Email: henry.huang@teingesch.com Tel: +86-769-81619505

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Material specification of membrane switch in pre-production stage — Mold Tooling (Part II)

Greetings, everyone! I am Xiaoqiong from Luphi Electronics. In our previous discussion, we delved into the material specifications of the membrane switch during the initial phase of production - mold tooling. We finalized details such as mold name, modulus, mode, as well as the raised features on the line and panel. Factors like punch type, time, temperature, pressure, height, elasticity, and folding were also taken into consideration. It was noted that the raised membrane switch does not allow backlight for the (LGF) key, as it cannot transmit light. Additionally, there are expected losses which we will address in our next communication.

That wraps up this update. Thank you for your continued support and I wish you all a joyful life ahead!




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